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论文题目: Design and Analysis of a Mutual Inductance Coupling-Based Micro Deformation Sensor
第一作者: Zhang RM(张如美);Liu H(刘浩);Zhou YY(周圆圆);Yang ZD(杨臻达);Han JD(韩建达)
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发表刊物: IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
发表年度: 2017
卷,期,页: 66,4,821-829
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论文摘要: Mutual inductance coupling-based electromagnetic sensors utilize the quasi-static or dynamic magnetic excitation and sensing signals to detect the multiaxis deformation. The compact size and high sensitivity allow their application in tiny and precise measurement systems, such as space-confined minimally invasive surgery. Until now, however, there has not been any theoretical derivation of the relationship between microdeformation and obtained electromagnetic signals yet. To address this problem, this paper presents a triaxial deformation sensor with corresponding measurement electronics based on lock-in technique to pick up the sensing signals for deformation reconstruction. Simulations and experiments were carried out to explore the relationship between mutual inductance and triaxial deformation, including longitudinal compression from 3 to 4.8 mm, inclination angle from -20 degrees to 20 degrees, and orientation angle from 0 degrees to 360 degrees. The results indicate that the orientation angle beta can be expressed in terms of arctan function of the mutual inductance and longitudinal compression rho can be achieved through polynomial fitting method. The inclination angle alpha shows a linearity with the mutual inductance components along alpha direction when rho is fixed, and the linear coefficient changes with rho. Finally, the deformation was reconstructed with the average errors of 0.00037 mm, 0.9199 degrees, and 0.000026 degrees and the corresponding root-mean-square errors of 0.0144 mm, 1.3608 degrees, and 0.1356 degrees for rho, beta, and alpha, respectively. The reconstruction algorithms and measurement circuit will promote the application of microtriaxial deformation sensors in high precision displacement measurement and multiaxis force sensing systems.
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